BONSEYES : platform for open development of systems of artificial intelligence

Llewellynn, Tim (nVISO SA, Switzerland) ; Milagro Fernandez-Carrobles, Maria del (University of Castilla-La Mancha, Spain) ; Deniz, Oscar (University of Castilla-La Mancha, Spain) ; Fricker, Samuel (i4Ds Centre for Requirements Engineering, FHNW, Switzerland) ; Storkey, Amos (University of Edinburgh, United Kingdom) ; Pazos Escudero, Nuria (Haute école Arc Ingénierie, HES-SO // Haute Ecole Spécialisée de Suisse Occidentale) ; Velikic, Gordana (RT-RK, Serbia) ; Leufgen, Kirsten (SCIPROM SARL, Switzerland) ; Dahyot, Rozenn (Trinity College Dublin, Ireland) ; Koller, Sebastien (Technical University Munich, Germany) ; Goumas, Georgios (The Institute of Communications and Computer Systems of the National, Technical University of Athens, Greece) ; Leitner, Peter (SYNYO GmbH, Austria) ; Dasika, Ganesh (ARM Ltd., United Kingdom) ; Wang, Lei (ZF Friedrichshafen AG, Germany) ; Tutschku, Kurt (Blekinge Institute of Technology (BTH), Sweden)

The Bonseyes EU H2020 collaborative project aims to develop a platform consisting of a Data Marketplace, a Deep Learning Toolbox, and Developer Reference Platforms for organizations wanting to adopt Artificial Intelligence. The project will be focused on using artificial intelligence in low power Internet of Things (IoT) devices ("edge computing"), embedded computing systems, and data center servers ("cloud computing"). It will bring about orders of magnitude improvements in efficiency, performance, reliability, security, and productivity in the design and programming of systems of artificial intelligence that incorporate Smart Cyber-Physical Systems (CPS). In addition, it will solve a causality problem for organizations who lack access to Data and Models. Its open software architecture will facilitate adoption of the whole concept on a wider scale. To evaluate the effectiveness, technical feasibility, and to quantify the real-world improvements in efficiency, security, performance, effort and cost of adding AI to products and services using the Bonseyes platform, four complementary demonstrators will be built. Bonseyes platform capabilities are aimed at being aligned with the European FI-PPP activities and take advantage of its flagship project FIWARE. This paper provides a description of the project motivation, goals and preliminary work.

Conference Type:
full paper
Ingénierie et Architecture
HE-Arc Ingénierie
New York, ACM
New York
Sienne (Italie)
Computing Frontiers Conference (CF)
6 p.
Published in:
CF'17 Proceedings of the Computing Frontiers Conference
Numeration (vol. no.):
2017, pp. 299-304
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Note: The status of this file is: restricted

 Record created 2018-02-13, last modified 2021-03-26

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