Silicon wafer defect detection using high frequency guided waves

Lauper, Michael (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Fromme, Paul (Department of Mechanical Engineering, University College London, London, United Kingdom) ; Robyr, Jean-Luc (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Masserey, Bernard (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland)

In the photovoltaic industry monocrystalline silicon wafers are employed for the manufacture of solar panels with high conversion efficiency. The cutting process induces micro-cracks on the thin wafer surface. High frequency guided ultrasonic waves are considered for the structural monitoring of the wafers and the nondestructive characterization of the micro-cracks. The material anisotropy of the monocrystalline silicon leads to variations of the wave characteristics depending on the propagation direction relative to the crystal orientation. In non-principal directions of the crystal, wave beam skewing occurs. Selective excitation of the fundamental Lamb wave modes was achieved using a custom-made angle beam transducer and holder to achieve a controlled contact pressure. The out-of-plane component of the guided wave propagation was measured using a noncontact laser interferometer. Artificial defects were introduced in the wafers using a micro indenter with varying loads. The defects were characterized from microscopy images to measure the indent size and combined crack length. The scattering of the A0 Lamb wave mode was measured experimentally and the characteristics of the scattered wave field were correlated to the defect size. The detection sensitivity is discussed.


Keywords:
Conference Type:
full paper
Faculty:
Ingénierie et Architecture
School:
HEIA-FR
Institute:
SeSi - Institut de Systèmes d'ingénierie durables
Subject(s):
Ingénierie
Publisher:
Denver, Colorado, United States, 27 March 2018
Date:
2018-03
Denver, Colorado, United States
27 March 2018
Pagination:
8 p.
Published in:
Proceedings of SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: Health Monitoring of Structural and Biological Systems XII, Denver, Colorado, United States, 4-8 March 2018
Numeration (vol. no.):
2018, 10600
DOI:
Appears in Collection:

Note: The status of this file is: restricted


 Record created 2018-10-17, last modified 2018-12-20

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