Guided ultrasonic wave beam skew in silicon wafers
2018
Files
Details
Title
Guided ultrasonic wave beam skew in silicon wafers
Author(s)
Pizzolato, Marco (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Masserey, Bernard (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Robyr, Jean-Luc (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Fromme, Paul (Department of Mechanical Engineering, University College London)
Masserey, Bernard (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Robyr, Jean-Luc (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Fromme, Paul (Department of Mechanical Engineering, University College London)
Date
2018-04
Published in
Proceedings of 44th annual review of progress in quantitative nondestructive evaluation, vol. 37, Provo, Utah, USA, 16-21 July 2017
Volume
2018, 1949, 09005
Publisher
Provo, Utah, USA, 16-21 July 2017
Pagination
8 p.
Presented at
44th annual review of progress in quantitative nondestructive evaluation, Provo {84603}, Utah, USA, 2017-07-16, 2017-07-21
ISBN
978-0-7354-1644-4
Keywords
elastic anisotropy ; lamb wave modes ; NDE ; skew angle ; phase slowness
Paper type
full paper
Faculty
Ingénierie et Architecture
School
HEIA-FR
Institute
SeSi - Institut de Systèmes d'ingénierie durables
Record Appears in
Conference materials
Global
Global