Guided ultrasonic wave beam skew in silicon wafers
2018
Einzelheiten
Titel
Guided ultrasonic wave beam skew in silicon wafers
Autor(en)/ in(nen)
Pizzolato, Marco (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Masserey, Bernard (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Robyr, Jean-Luc (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Fromme, Paul (Department of Mechanical Engineering, University College London)
Masserey, Bernard (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Robyr, Jean-Luc (School of Engineering and Architecture (HEIA-FR), HES-SO University of Applied Sciences Western Switzerland)
Fromme, Paul (Department of Mechanical Engineering, University College London)
Datum
2018-04
Veröffentlich in
Proceedings of 44th annual review of progress in quantitative nondestructive evaluation, vol. 37, Provo, Utah, USA, 16-21 July 2017
Band
2018, 1949, 09005
Verlag
Provo, Utah, USA, 16-21 July 2017
Umfang
8 p.
Vorgestellt auf
44th annual review of progress in quantitative nondestructive evaluation, Provo {84603}, Utah, USA, 2017-07-16, 2017-07-21
ISBN
978-0-7354-1644-4
Schlüsselwörter
elastic anisotropy ; lamb wave modes ; NDE ; skew angle ; phase slowness
Papiertyp
full paper
Domaine
Ingénierie et Architecture
Ecole
HEIA-FR
Institut
SeSi - Institut de Systèmes d'ingénierie durables
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