Internet of Tangibles

Angelini, Leonardo (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Mugellini, Elena (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Abou Khaled, Omar (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Couture, Nadine (ESTIA LaBRI, Bidart, France) ; van der Hoven, Elise (University of technology Sydney, Australia ; University of technology Eindhoven, the Netherlands, University of Dundee, the United Kingdom, ARC Centre of Excellence on Cognition and its Disorders, Australia) ; Bakker, Saskia (Industrial Design Department, University of Technology, Eindhoven, The Netherlands)

There is an increasing interest in the HCI research community to design richer user interactions with the Internet of Things (IoT). This studio will allow exploring the design of tangible interaction with the IoT, what we call Internet of Tangibles. In particular, we aim at investigating the full interaction-attention continuum, with the purpose of designing IoT tangible interfaces that can switch between peripheral interactions that do not disrupt everyday routines, and focused interactions that support user’s reflections. This investigation will be conducted through hands-on activities where participants will prototype tangible IoT objects, starting by a paper prototyping phase, supported by design cards, and followed by an Arduino prototype phase. The purpose of the studio is also establishing a community of researchers and practitioners, from both academy and industry, interested in the field of tangible interaction with the Internet of Things.


Keywords:
Conference Type:
full paper
Faculty:
Ingénierie et Architecture
School:
HEIA-FR
Institute:
HumanTech - Technology for Human Wellbeing Institute
Subject(s):
Ingénierie
Publisher:
Stockholm, Sweden, 18-21 march 2018
Date:
2018-03
Stockholm, Sweden
18-21 march 2018
Pagination:
4 p.
Published in:
Proceedings of 12th International Conference on Tangible, Embedded and Embodied Interactions (TEI'18), 18-21 March 2018, Stockholm, Sweden
DOI:
ISBN:
9781450355681
Appears in Collection:



 Record created 2019-01-22, last modified 2019-01-29

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