High frequency guided wave defect imaging in monocrystalline silicon wafers

Simon, Mathieu (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Masserey, Bernard (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Robyr, Jean-Luc (School of Engineering and Architecture (HEIA-FR), HES-SO // University of Applied Sciences Western Switzerland) ; Fromme, Paul (University College London, London, United Kingdom)

Micro-cracks can be induced in thin monocrystalline silicon wafers during the manufacture of solar panels. High frequency guided waves allow for the monitoring of wafers and characterization of defects. Selective excitation of the first antisymmetric A0 guided wave mode was achieved experimentally using a custom-made wedge transducer. The Lamb wave scattered field in the vicinity of artificial defects was measured using a noncontact laser interferometer. The surface extent of the shallow defects varying in size from 30 µm to 100 µm was characterized using an optical microscope. The characteristics of the scattered wave field were correlated to the defect size and the detection sensitivity was discussed.


Mots-clés:
Type de conférence:
full paper
Faculté:
Ingénierie et Architecture
Ecole:
HEIA-FR
Institut:
SeSi - Institut de Systèmes d'ingénierie durables
Adresse bibliogr.:
Denver, Colorado, USA, 1 April 2019
Date:
2019-04
Denver, Colorado, USA
1 April 2019
Pagination:
8 p.
Publié dans:
Proceedings SPIE 10972, Health Monitoring of Structural and Biological Systems XIII, Smart Structures + Nondestructive Evaluation, 1 April 2019, Denver, Colorado, USA
DOI:
ISBN:
9781510625990
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 Notice créée le 2020-01-07, modifiée le 2020-10-27

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