Chip-off by matter subtraction : frigida via

Billard, David ( Haute école de gestion de Genève, HES-SO // Haute Ecole Spécialisée de Suisse Occidentale) ; Vidonne, Paul ( LERTI, France)

This work introduces an unpublished technique for extracting data from flash memory chips, especially from Ball Grid Array (BGA) components. This technique does not need any heating of the chip component, as opposed to infrared or hot air de-soldering. In addition, it avoids the need of re-balling BGA in case of missing balls at the wrong place. Thus it enhances the quality and integrity of the data extraction. However, this technique is destructive for the device motherboard and has limitations when memory chip content is encrypted. The technique works by subtracting matter by micro-milling, without heating. The technique has been extensively used in about fifty real cases for more than one year. It is named frigida via, compared to the calda via of infrared heating.


Keywords:
Conference Type:
full paper
Faculty:
Economie et Services
School:
HEG - Genève
Institute:
CRAG - Centre de Recherche Appliquée en Gestion
Subject(s):
Informatique
Publisher:
Málaga , Safe Society Labs
Date:
Málaga
Safe Society Labs
2015
Pagination:
Pp. 19-24
Published in
Proceedings of the 10th International Conference on Systematic Approaches to Digital Forensic Engineering
External resources:
Appears in Collection:



 Record created 2015-10-22, last modified 2018-12-07

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